Data / Hiring / Idaho / Micron Technology, Inc.
Micron Technology, Inc. in Boise, ID: 2,065 certified H-1B and PERM cases, FY2023 to FY2026
Micron Technology, Inc., Boise, ID, had 2,065 certified H-1B and PERM cases in Department of Labor disclosure data, decided from October 4, 2022 to June 29, 2026: 1,755 H-1B labor condition applications and 310 PERM labor certifications. Its most frequent role is Semiconductor Process Engineer in Boise, ID, at a median offered wage of $122,500 a year.
SpecStream is the live web data engine for teams and agents. It reads the Department of Labor's H-1B and PERM disclosure files and keeps each employer's filings by role, place and wage. Ask for your own cut (a role, a state, a list of companies) and new filings arrive in your sheet, CRM, Slack or agent.
- 75-1618004Employer ID (FEIN)
- Boise, IDAddress
- 2,065Certified cases
- 2,065Positions requested
- 39Denied or withdrawn
Certified cases by fiscal year
Fiscal years run from October 1 to September 30. The latest year covers decisions through June 29, 2026.
| Fiscal year | H-1B | PERM | Positions | Median offered wage |
|---|---|---|---|---|
| FY2023 | 298 | 81 | 379 | $110,240 |
| FY2024 | 427 | 27 | 454 | $122,180 |
| FY2025 | 565 | 61 | 626 | $124,440 |
| FY2026 | 465 | 141 | 606 | $126,962 |
Roles certified
Cases with the same job title, occupation code and worksite are grouped. Offered wage is the wage the employer filed; the range leaves out the lowest and highest 5% when a group has 20 cases or more. The prevailing wage is the one the employer filed against. A blank worksite means the file does not give one.
| Job title | Occupation | Worksite | Cases | Years | Median offered | Offered range | Median prevailing | Wage level | Program | Latest decision | Latest case number | Source |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Semiconductor Process Engineer | 17-2131 Materials Engineers | Boise, ID | 23 | FY2024 to FY2026 | $115,000 | $90,000 to $137,795 | $86,445 | II | H-1B | May 14, 2026 | I-200-26127-883408 | dol.gov |
| Supply Chain Engineer | 17-2112 Industrial Engineers | Boise, ID | 23 | FY2023 to FY2026 | $97,200 | $85,000 to $112,000 | $82,399 | II | H-1B, PERM | May 22, 2026 | I-200-26135-916928 | dol.gov |
| Semiconductor Design Engineer | 17-2071 Electrical Engineers | Boise, ID | 18 | FY2023 to FY2026 | $109,191 | $91,000 to $157,000 | $103,272 | II | H-1B, PERM | May 20, 2026 | I-200-26133-905228 | dol.gov |
| Equipment Engineer | 17-2141 Mechanical Engineers | Manassas, VA | 13 | FY2023 to FY2026 | $104,040 | $92,000 to $144,900 | $87,194 | I | H-1B, PERM | June 25, 2026 | I-200-26168-027090 | dol.gov |
| FAB Engineer | 17-2112 Manufacturing Engineers | Manassas, VA | 10 | FY2024 to FY2026 | $101,954 | $90,699 to $142,731 | $82,451 | I | H-1B | June 25, 2026 | I-200-26168-027312 | dol.gov |
| Semiconductor Design Engineer | 17-2072 Electronics Engineers, Except Computer | Boise, ID | 10 | FY2024 to FY2026 | $107,560 | $93,275 to $125,500 | $94,744 | II | H-1B, PERM | June 3, 2026 | G-100-25111-885368 | dol.gov |
| Equipment Engineer | 17-2141 Mechanical Engineers | Boise, ID | 9 | FY2024 to FY2026 | $119,994 | $98,000 to $155,000 | $86,382 | IV | H-1B, PERM | May 18, 2026 | I-200-26131-895515 | dol.gov |
| Semiconductor Design Engineer | 17-2071 Electrical Engineers | Atlanta, GA | 9 | FY2024 to FY2026 | $114,683 | $100,000 to $145,860 | $97,282 | II | H-1B | April 23, 2026 | I-200-26106-801678 | dol.gov |
| Semiconductor Design Engineer | 17-2071 Electrical Engineers | Richardson, TX | 9 | FY2025 to FY2026 | $130,000 | $111,500 to $138,956 | $82,722 | II | H-1B | May 21, 2026 | I-200-26134-909719 | dol.gov |
| Product Development Engineer | 17-2072 Electronics Engineers, Except Computer | Boise, ID | 8 | FY2024 to FY2026 | $94,762 | $92,246 to $134,500 | $84,531 | II | H-1B | May 7, 2026 | I-200-26120-853795 | dol.gov |
| Operations Improvement Engineer | 17-2112 Industrial Engineers | Manassas, VA | 7 | FY2023 to FY2026 | $95,950 | $88,150 to $117,636 | $88,658 | II | H-1B, PERM | April 30, 2026 | I-200-26113-826450 | dol.gov |
| Process Engineer | 17-2131 Materials Engineers | Manassas, VA | 7 | FY2023 to FY2026 | $107,453 | $91,738 to $120,926 | $96,275 | II | H-1B, PERM | March 13, 2026 | I-200-26065-685273 | dol.gov |
| Semiconductor Process Engineer | 17-2112 Industrial Engineers | Boise, ID | 7 | FY2024 to FY2026 | $94,621 | $80,510 to $128,125 | $86,923 | II | H-1B, PERM | May 7, 2026 | I-200-26120-855074 | dol.gov |
| Semiconductor Process Engineer | 17-2071 Electrical Engineers | Boise, ID | 7 | FY2023 to FY2025 | $97,000 | $83,000 to $118,000 | $95,555 | II | H-1B | May 20, 2025 | I-200-25133-970174 | dol.gov |
| Senior Design Engineer | 17-2071 Electrical Engineers | San Jose, CA | 7 | FY2023 to FY2026 | $146,513 | $133,544 to $179,000 | $124,259 | II | H-1B, PERM | March 12, 2026 | G-100-24313-464576 | dol.gov |
| Firmware Engineer | 17-2071 Electrical Engineers | San Jose, CA | 6 | FY2023 to FY2026 | $141,129 | $120,000 to $160,000 | $115,068 | II | H-1B, PERM | February 27, 2026 | G-100-24284-399458 | dol.gov |
| IT Software Engineer | 15-1252 Software Developers | Boise, ID | 6 | FY2024 to FY2026 | $95,914 | $87,550 to $105,000 | $73,653 | I | H-1B, PERM | April 7, 2026 | I-200-26090-743147 | dol.gov |
| Product Development Engineer | 17-2071 Electrical Engineers | Boise, ID | 6 | FY2024 to FY2026 | $98,329 | $95,000 to $122,746 | $96,378 | II | H-1B | May 20, 2026 | I-200-26133-905994 | dol.gov |
| Software Development Engineer | 15-1252 Software Developers | Boise, ID | 6 | FY2023 to FY2026 | $97,514 | $84,000 to $101,340 | $87,796 | II | H-1B | May 7, 2026 | I-200-26120-853558 | dol.gov |
| Semiconductor Product Engineer | 17-2072 Electronics Engineers, Except Computer | Boise, ID | 6 | FY2023 to FY2026 | $95,218 | $85,663 to $112,180 | $85,467 | II | H-1B, PERM | April 2, 2026 | I-200-26085-732314 | dol.gov |
| Semiconductor Product Engineer | 17-2071 Electrical Engineers | Boise, ID | 6 | FY2023 to FY2026 | $103,950 | $93,210 to $123,081 | $95,496 | II | H-1B | April 10, 2026 | I-200-26093-757004 | dol.gov |
| Supply Chain Engineer | 13-1081 Logisticians | Boise, ID | 6 | FY2025 to FY2026 | $98,764 | $90,000 to $103,286 | $66,414 | II | H-1B, PERM | May 11, 2026 | I-200-26124-867310 | dol.gov |
| DRAM Design Engineer | 17-2072 Electronics Engineers, Except Computer | Boise, ID | 5 | FY2023 to FY2026 | $107,326 | $99,209 to $122,520 | $92,082 | II | H-1B, PERM | June 11, 2026 | I-200-26155-981131 | dol.gov |
| IT Solution Architect - PLM | 15-1299 Computer Systems Engineers/Architects | Boise, ID | 5 | FY2023 to FY2024 | $121,890 | $120,000 to $123,456 | $95,909 | IV | H-1B | February 23, 2024 | I-200-24046-721260 | dol.gov |
| Industrial Engineer | 17-2112 Industrial Engineers | Boise, ID | 5 | FY2023 to FY2026 | $98,964 | $81,000 to $117,082 | $79,872 | II | H-1B, PERM | February 27, 2026 | G-100-24288-403994 | dol.gov |
| Software Engineer | 15-1252 Software Developers | Boise, ID | 5 | FY2024 to FY2026 | $97,269 | $84,993 to $117,300 | $97,268 | II | H-1B | April 30, 2026 | I-200-26113-826643 | dol.gov |
| Supply Chain Planner | 17-2112 Industrial Engineers | Boise, ID | 5 | FY2023 to FY2026 | $96,000 | $86,005 to $100,423 | $79,872 | II | H-1B, PERM | February 27, 2026 | G-100-24278-387621 | dol.gov |
| Data Scientist | 15-2051 Data Scientists | Boise, ID | 4 | FY2024 to FY2025 | $128,310 | $103,200 to $145,000 | $92,560 | II | H-1B | July 8, 2025 | I-200-25181-139688 | dol.gov |
| Design Engineer | 17-2072 Electronics Engineers, Except Computer | San Jose, CA | 4 | FY2024 to FY2026 | $131,087 | $122,813 to $179,000 | $126,240 | II | H-1B, PERM | February 5, 2026 | G-100-24257-337401 | dol.gov |
| FAB Engineer | 17-2141 Mechanical Engineers | Manassas, VA | 4 | FY2023 to FY2026 | $103,644 | $91,140 to $119,770 | $96,578 | II | H-1B | April 30, 2026 | I-200-26113-826788 | dol.gov |
| Firmware Engineer | 17-2072 Electronics Engineers, Except Computer | San Jose, CA | 4 | FY2024 to FY2026 | $139,788 | $123,600 to $226,800 | $139,038 | II | H-1B | June 26, 2026 | I-200-26170-034307 | dol.gov |
| Machine Learning Engineer | 15-2051 Data Scientists | Boise, ID | 4 | FY2025 to FY2026 | $143,832 | $142,725 to $172,126 | $102,950 | II | H-1B | May 21, 2026 | I-200-26134-913627 | dol.gov |
| Manufacturing Engineer | 17-2112 Validation Engineers | Boise, ID | 4 | FY2024 to FY2026 | $91,864 | $90,000 to $93,974 | $87,978 | I | H-1B | April 8, 2026 | I-200-26091-748981 | dol.gov |
| Principal ASIC Design Verification Engineer | 17-2071 Electrical Engineers | San Jose, CA | 4 | FY2024 to FY2026 | $230,000 | $215,000 to $303,000 | $213,595 | IV | H-1B, PERM | January 28, 2026 | G-100-24247-310483 | dol.gov |
| Principal Engineer, NVE SSD PE | 17-2061 Computer Hardware Engineers | Longmont, CO | 4 | FY2026 | $170,039 | $169,929 to $170,039 | $113,700 | III | H-1B | June 15, 2026 | I-200-26159-991688 | dol.gov |
| Process Development Engineer | 17-2131 Materials Engineers | Boise, ID | 4 | FY2025 to FY2026 | $122,216 | $115,000 to $132,000 | $95,274 | III | H-1B | April 10, 2026 | I-200-26093-756419 | dol.gov |
| Process Engineer | 17-2041 Chemical Engineers | Manassas, VA | 4 | FY2023 to FY2026 | $103,792 | $81,474 to $117,436 | $92,020 | I | H-1B, PERM | May 21, 2026 | I-200-26134-909693 | dol.gov |
| Semiconductor Design Engineer | 17-2072 Electronics Engineers, Except Computer | Richardson, TX | 4 | FY2025 to FY2026 | $121,420 | $102,235 to $128,000 | $97,822 | I | H-1B | May 14, 2026 | I-200-26127-884255 | dol.gov |
| Semiconductor Process Engineer | 17-2041 Chemical Engineers | Boise, ID | 4 | FY2024 to FY2026 | $98,046 | $77,000 to $124,680 | $92,165 | I | H-1B, PERM | May 6, 2026 | I-200-26119-850800 | dol.gov |
| Semiconductor Process Engineer | 17-2072 Electronics Engineers, Except Computer | Boise, ID | 4 | FY2024 to FY2026 | $111,668 | $104,312 to $124,608 | $100,433 | III | H-1B | May 21, 2026 | I-200-26134-911709 | dol.gov |
| Senior Semiconductor Process Engineer | 17-2071 Electrical Engineers | Boise, ID | 4 | FY2024 to FY2026 | $135,262 | $120,665 to $180,250 | $135,262 | III | H-1B | June 18, 2026 | I-200-26162-005659 | dol.gov |
| Validation Engineer | 17-2112 Validation Engineers | Boise, ID | 4 | FY2023 to FY2026 | $75,000 | $75,000 to $93,106 | $77,262 | I | H-1B, PERM | April 1, 2026 | I-200-26084-729914 | dol.gov |
| ="Equipment Engineer" | Mechanical Engineers | Manassas, VA | 3 | FY2025 | $98,375 | $88,184 to $150,000 | $84,989 | I | H-1B | February 27, 2025 | I-200-25051-710264 | dol.gov |
| ASIC Engineer | 17-2071 Electrical Engineers | Minneapolis, MN | 3 | FY2024 to FY2025 | $136,500 | $136,500 to $190,000 | $94,203 | II | H-1B | April 7, 2025 | I-200-25090-815074 | dol.gov |
| Architecture Modeling Engineer | 17-2072 Electronics Engineers, Except Computer | Boise, ID | 3 | FY2023 to FY2025 | $115,000 | $99,958 to $115,000 | $93,850 | III | H-1B, PERM | July 28, 2025 | G-100-24101-871973 | dol.gov |
| Business Intelligence Analyst, SMAI | 15-2051 Business Intelligence Analysts | Boise, ID | 3 | FY2023 | $105,300 | $96,551 to $105,300 | $97,947 | III | H-1B | July 27, 2023 | I-200-23201-202648 | dol.gov |
| DRAM Design Engineer | 17-2071 Electrical Engineers | Boise, ID | 3 | FY2023 to FY2026 | $107,591 | $94,710 to $116,711 | $95,555 | II | H-1B | February 25, 2026 | I-200-26049-648908 | dol.gov |
| Eng-Deg Technology Node Dev De | 17-2072 Electronics Engineers, Except Computer | Boise, ID | 3 | FY2024 | $102,062 | $102,062 to $102,062 | $96,554 | III | H-1B | June 24, 2024 | I-200-24166-113878 | dol.gov |
| Engineer - DEG DESIGN | 17-2071 Electrical Engineers | Atlanta, GA | 3 | FY2023 to FY2026 | $88,000 | $88,000 to $130,515 | $95,700 | III | H-1B, PERM | February 27, 2026 | G-100-24295-421064 | dol.gov |
| Equipment Engineer 3 | 17-2141 Mechanical Engineers | Boise, ID | 3 | FY2025 to FY2026 | $122,400 | $115,733 to $127,251 | $88,275 | III | H-1B | March 24, 2026 | I-200-26076-709641 | dol.gov |
| Facilities Operations Hvac/R Tab Coordinator | 17-2112 Industrial Engineers | Boise, ID | 3 | FY2024 | $90,477 | $90,477 to $94,468 | $90,168 | III | H-1B | July 17, 2024 | I-200-24192-186438 | dol.gov |
| Facilities Mechanical Engineer | 17-2141 Mechanical Engineers | Manassas, VA | 3 | FY2025 to FY2026 | $96,820 | $94,000 to $100,500 | $84,989 | I | H-1B, PERM | February 5, 2026 | G-100-24271-370036 | dol.gov |
| Firmware Engineer | 15-1252 Software Developers | San Jose, CA | 3 | FY2026 | $149,365 | $147,276 to $149,365 | $143,504 | I | H-1B | June 23, 2026 | I-200-26166-016678 | dol.gov |
| Global Facilities O&M Engineer | 17-2141 Mechanical Engineers | Manassas, VA | 3 | FY2025 to FY2026 | $90,567 | $87,000 to $102,070 | $84,989 | I | H-1B, PERM | March 12, 2026 | G-100-24309-450951 | dol.gov |
| Hardware Engineer | 17-2071 Electrical Engineers | Longmont, CO | 3 | FY2025 | $145,260 | $139,050 to $165,732 | $131,830 | III | H-1B | September 4, 2025 | I-200-25239-272026 | dol.gov |
| IT Business Process Analyst | 15-2051 Business Intelligence Analysts | Boise, ID | 3 | FY2024 to FY2025 | $90,000 | $71,760 to $97,850 | $71,760 | I | H-1B | June 18, 2025 | I-200-25162-081430 | dol.gov |
| IT Solution Architect | 15-1252 Software Developers | Boise, ID | 3 | FY2024 to FY2025 | $150,229 | $125,000 to $155,213 | $128,024 | III | H-1B | August 12, 2025 | I-200-25217-221933 | dol.gov |
| IT Solution Architect - PLM | 15-1252 Software Developers | Boise, ID | 3 | FY2025 to FY2026 | $127,963 | $123,781 to $127,963 | $120,600 | H-1B | December 1, 2025 | I-200-25262-323349 | dol.gov | |
| Industrial Engineer | 17-2112 Industrial Engineers | Savannah, GA | 3 | FY2025 | $103,484 | $98,556 to $103,484 | $91,853 | II | H-1B | December 30, 2024 | I-200-24354-560125 | dol.gov |
| Industrial Engineer 3 | 17-2112 Industrial Engineers | Boise, ID | 3 | FY2025 to FY2026 | $107,500 | $105,000 to $114,147 | $102,752 | II | H-1B, PERM | January 17, 2026 | G-100-24243-306922 | dol.gov |
| Machine Learning Engineer | 15-1252 Software Developers | Boise, ID | 3 | FY2023 to FY2025 | $137,160 | $136,665 to $141,110 | $88,816 | II | H-1B, PERM | July 30, 2025 | G-100-24120-937772 | dol.gov |
| NAND PI Engineer | 17-2071 Electrical Engineers | Boise, ID | 3 | FY2023 | $111,440 | $108,500 to $112,000 | $96,990 | II | H-1B | September 8, 2023 | I-200-23243-311868 | dol.gov |
| Operation Improvement Engineer | 17-2112 Industrial Engineers | Manassas, VA | 3 | FY2023 to FY2026 | $106,413 | $92,310 to $131,588 | $102,586 | II | H-1B | March 16, 2026 | I-200-26068-688280 | dol.gov |
| Operations Improvement Engineer | 17-2112 Industrial Engineers | 3 | FY2023 | $86,625 | $83,325 to $115,718 | $83,325 | Level II | PERM | May 10, 2023 | A-22131-53780 | dol.gov | |
| Parametric Engineer | 17-2071 Electrical Engineers | Manassas, VA | 3 | FY2023 to FY2025 | $107,825 | $101,000 to $120,165 | $106,413 | II | H-1B, PERM | August 25, 2025 | G-100-24142-021965 | dol.gov |
| Principal Firmware Engineer | 17-2072 Electronics Engineers, Except Computer | San Jose, CA | 3 | FY2024 to FY2025 | $204,874 | $200,000 to $231,975 | $180,003 | IV | H-1B | October 22, 2024 | I-200-24289-408627 | dol.gov |
| Principal SSD Firmware Test Engineer | 17-2071 Electrical Engineers | San Jose, CA | 3 | FY2024 to FY2025 | $186,814 | $168,300 to $190,028 | $141,440 | II | H-1B | August 1, 2025 | I-200-25206-199794 | dol.gov |
| Process Development Engineer | 17-2041 Chemical Engineers | Boise, ID | 3 | FY2025 | $121,000 | $119,600 to $123,000 | $101,130 | II | H-1B | May 19, 2025 | I-200-25132-965626 | dol.gov |
| Process Engineer | 17-2112 Manufacturing Engineers | Manassas, VA | 3 | FY2025 to FY2026 | $106,565 | $91,000 to $120,207 | $102,586 | II | H-1B | May 4, 2026 | I-200-26117-840506 | dol.gov |
| Product Development Engineer | 17-2131 Materials Engineers | Boise, ID | 3 | FY2025 to FY2026 | $120,915 | $120,905 to $126,313 | $110,094 | IV | H-1B | May 7, 2026 | I-200-26120-854969 | dol.gov |
| Product Operations Manager | 11-3071 Supply Chain Managers | Boise, ID | 3 | FY2025 to FY2026 | $138,525 | $114,319 to $138,601 | $106,226 | IV | H-1B, PERM | March 10, 2026 | I-200-26062-676339 | dol.gov |
| Quality Engineer | 17-2112 Manufacturing Engineers | Boise, ID | 3 | FY2024 to FY2026 | $87,150 | $83,000 to $110,984 | $79,872 | II | H-1B, PERM | January 13, 2026 | G-100-24227-267529 | dol.gov |
| R&D Device Characterization Engineer | 17-2071 Electrical Engineers | Boise, ID | 3 | FY2023 to FY2026 | $105,252 | $101,988 to $120,652 | $96,272 | II | H-1B, PERM | February 24, 2026 | G-100-24276-379518 | dol.gov |
| R&D Dry Etch Process Development Engineer | 17-2131 Materials Engineers | Boise, ID | 3 | FY2023 to FY2026 | $126,499 | $115,000 to $139,590 | $90,251 | III | H-1B | April 8, 2026 | I-200-26091-747235 | dol.gov |
| R&D Metrology Process Development Engineer | 17-2072 Electronics Engineers, Except Computer | Boise, ID | 3 | FY2024 to FY2025 | $101,000 | $101,000 to $112,828 | $96,470 | III | H-1B | May 1, 2025 | I-200-25114-901134 | dol.gov |
| Senior Engineer – Mdg | 17-2041 Chemical Engineers | Boise, ID | 3 | FY2023 to FY2026 | $127,775 | $127,775 to $148,227 | $113,994 | IV | H-1B, PERM | April 13, 2026 | G-100-24355-564573 | dol.gov |
| SSD Validation Engineer | 17-2071 Electrical Engineers | Longmont, CO | 3 | FY2023 to FY2024 | $119,726 | $110,000 to $143,999 | $104,874 | II | H-1B | April 16, 2024 | I-200-24100-869514 | dol.gov |
| Scribe Design Engineer | 17-2071 Electrical Engineers | Boise, ID | 3 | FY2023 to FY2025 | $98,500 | $95,555 to $117,139 | $99,414 | II | H-1B, PERM | July 11, 2025 | G-100-24073-795380 | dol.gov |
| Semiconductor Design Engineer | 17-2072 Electronics Engineers, Except Computer | San Jose, CA | 3 | FY2023 to FY2026 | $132,600 | $126,984 to $154,000 | $135,968 | II | H-1B, PERM | February 27, 2026 | G-100-24296-424500 | dol.gov |
| Semiconductor Design Engineer | 17-2071 Electrical Engineers | San Jose, CA | 3 | FY2023 to FY2025 | $125,000 | $120,627 to $139,880 | $124,259 | I | H-1B | June 4, 2025 | I-200-25148-024829 | dol.gov |
| Senior Data Scientist | 15-2051 Data Scientists | Boise, ID | 3 | FY2024 to FY2026 | $140,000 | $122,800 to $143,208 | $110,531 | III | H-1B | March 26, 2026 | I-200-26078-716966 | dol.gov |
| Senior Engineer, HBM Design Architecture | 17-2071 Electrical Engineers | Folsom, CA | 3 | FY2024 | $147,047 | $123,568 to $147,047 | $123,490 | III | H-1B | January 12, 2024 | I-200-24005-619627 | dol.gov |
| Senior Financial Analyst | 13-2051 Financial and Investment Analysts | Boise, ID | 3 | FY2024 to FY2026 | $95,064 | $92,700 to $103,500 | $70,262 | II | H-1B | May 12, 2026 | I-200-26125-872164 | dol.gov |
| Senior Financial Analyst II | 13-2051 Financial and Investment Analysts | Boise, ID | 3 | FY2024 to FY2026 | $105,624 | $101,476 to $113,811 | $94,723 | IV | H-1B | April 14, 2026 | I-200-26097-763602 | dol.gov |
| Senior Semiconductor Design Engineer | 17-2071 Electrical Engineers | Boise, ID | 3 | FY2024 | $150,965 | $149,980 to $155,000 | $135,512 | IV | H-1B | July 31, 2024 | I-200-24206-218165 | dol.gov |
| Senior Software Engineer | 15-1252 Software Developers | Boise, ID | 3 | FY2023 to FY2026 | $127,960 | $125,000 to $171,100 | $124,505 | IV | H-1B | March 10, 2026 | I-200-26062-676109 | dol.gov |
| Senior Supply Chain Planner | 13-1081 Logisticians | Boise, ID | 3 | FY2025 | $97,850 | $85,000 to $112,575 | $73,320 | III | H-1B, PERM | July 30, 2025 | G-100-24110-908445 | dol.gov |
| Sr Engineer, Photo DRAM | 17-2131 Materials Engineers | Boise, ID | 3 | FY2026 | $126,748 | $124,774 to $126,748 | $100,298 | III | H-1B | May 8, 2026 | I-200-26121-860849 | dol.gov |
| Sr Engineer, Scribe Design | 17-2071 Electrical Engineers | Boise, ID | 3 | FY2026 | $117,080 | $117,080 to $119,442 | $115,835 | II | H-1B | June 5, 2026 | I-200-26149-963962 | dol.gov |
| Sr Manager, Robotic Process Automation (RPA) | 11-3021 Computer and Information Systems Managers | Austin, TX | 3 | FY2023 to FY2026 | $194,000 | $185,000 to $203,700 | $170,581 | II | H-1B, PERM | April 13, 2026 | G-100-24341-524161 | dol.gov |
| Sr. Design Engineer | 17-2071 Electrical Engineers | San Jose, CA | 3 | FY2024 to FY2025 | $143,130 | $141,440 to $179,000 | $136,182 | II | H-1B, PERM | July 30, 2025 | G-100-24103-882537 | dol.gov |
| Sr. Hardware Development Engineer | 17-2071 Electrical Engineers | Boise, ID | 3 | FY2024 to FY2026 | $177,540 | $155,000 to $180,000 | $135,512 | IV | H-1B | December 15, 2025 | I-200-25342-465615 | dol.gov |
| Staff Design Engineer | 17-2071 Electrical Engineers | San Jose, CA | 3 | FY2026 | $175,684 | $173,038 to $177,876 | $159,890 | II | H-1B | June 9, 2026 | I-200-26153-973654 | dol.gov |
| Staff Design Engineer | 17-2072 Electronics Engineers, Except Computer | San Jose, CA | 3 | FY2024 to FY2026 | $168,827 | $165,827 to $192,553 | $153,504 | III | H-1B | April 6, 2026 | I-200-26089-740688 | dol.gov |
| Staff Physical Design Engineer | 17-2071 Electrical Engineers | Richardson, TX | 3 | FY2025 to FY2026 | $170,000 | $170,000 to $185,000 | $117,042 | IV | H-1B | May 7, 2026 | I-200-26120-853244 | dol.gov |
| Supply Chain Engineer | 17-2112 Industrial Engineers | 3 | FY2023 | $85,977 | $85,977 to $108,229 | $83,325 | Level II | PERM | June 9, 2023 | A-22054-15302 | dol.gov | |
| Supply Chain Inventory Optimization Engineer | 17-2112 Industrial Engineers | Boise, ID | 3 | FY2025 to FY2026 | $93,974 | $85,000 to $97,000 | $89,450 | I | H-1B, PERM | May 14, 2026 | I-200-26127-881505 | dol.gov |
| Supply Chain Planner | 13-1081 Logisticians | Boise, ID | 3 | FY2023 to FY2026 | $86,005 | $85,000 to $105,000 | $52,728 | II | H-1B, PERM | February 27, 2026 | G-100-24292-417864 | dol.gov |
| Systems Design Engineer 2 | 17-2112 Validation Engineers | Longmont, CO | 3 | FY2024 to FY2025 | $120,000 | $99,626 to $154,000 | $91,250 | II | H-1B, PERM | August 25, 2025 | G-100-24128-967023 | dol.gov |
| Test Engineer | 17-2071 Electrical Engineers | Boise, ID | 3 | FY2024 to FY2025 | $86,378 | $84,000 to $118,000 | $89,430 | II | H-1B, PERM | July 30, 2025 | G-100-24095-857059 | dol.gov |
| ="Advanced Modeling Engineer" | Electrical Engineers | Boise, ID | 2 | FY2025 | $130,242 | $125,485 to $135,000 | $102,170 | II | H-1B | March 18, 2025 | I-200-25070-766214 | dol.gov |
| ="Facilities Engineer 2" | Industrial Engineers | Boise, ID | 2 | FY2025 | $102,650 | $97,301 to $108,000 | $93,974 | II | H-1B | March 7, 2025 | I-200-25059-734634 | dol.gov |
| ="Industrial Engineer" | Industrial Engineers | Boise, ID | 2 | FY2025 | $106,250 | $105,000 to $107,500 | $93,974 | II | H-1B | February 13, 2025 | I-200-25037-672557 | dol.gov |
| ="Media Systems Engineer" | Data Scientists | San Jose, CA | 2 | FY2025 | $192,124 | $185,580 to $198,668 | $180,128 | III | H-1B | January 14, 2025 | I-200-25006-596748 | dol.gov |
| ="Process Engineer" | Manufacturing Engineers | Manassas, VA | 2 | FY2025 | $98,462 | $96,764 to $100,159 | $96,248 | II | H-1B | March 6, 2025 | I-200-25058-729036 | dol.gov |
| ="Semiconductor Design Engineer" | Electrical Engineers | Richardson, TX | 2 | FY2025 | $133,942 | $130,140 to $137,743 | $103,230 | III | H-1B | March 20, 2025 | I-200-25072-772893 | dol.gov |
| ="Semiconductor Process Engineer" | Mechanical Engineers | Boise, ID | 2 | FY2025 | $83,328 | $77,000 to $89,656 | $72,935 | II | H-1B | February 26, 2025 | I-200-25050-706883 | dol.gov |
| ="Software Development Engineer" | Software Developers | Boise, ID | 2 | FY2025 | $121,030 | $100,368 to $141,693 | $109,330 | H-1B | March 20, 2025 | I-200-25072-772241 | dol.gov | |
| ="Staff Systems Engineer, Functional Safety" | Electronics Engineers, Except Computer | Folsom, CA | 2 | FY2025 | $187,555 | $187,555 to $187,555 | $142,022 | IV | H-1B | March 17, 2025 | I-200-25069-762956 | dol.gov |
| Ate Process Engineer – Wp | 17-2112 Industrial Engineers | Manassas, VA | 2 | FY2026 | $103,265 | $102,265 to $104,265 | $82,451 | I | H-1B | June 25, 2026 | I-200-26169-027637 | dol.gov |
| Analog IC Layout Engineer | 17-2071 Electrical Engineers | Minneapolis, MN | 2 | FY2025 | $144,945 | $131,976 to $157,914 | $102,856 | II | H-1B | June 18, 2025 | I-200-25162-080948 | dol.gov |
| Analyst, IT People Systems | 15-1299 Computer Systems Engineers/Architects | San Jose, CA | 2 | FY2023 to FY2025 | $126,318 | $120,000 to $132,636 | $102,970 | I | H-1B | September 8, 2025 | I-200-25241-275754 | dol.gov |
| Applications Engineer | 17-2071 Electrical Engineers | Boise, ID | 2 | FY2023 to FY2024 | $111,750 | $96,000 to $127,500 | $103,870 | III | H-1B | August 8, 2024 | I-200-24214-238684 | dol.gov |
| Business Intelligence Analyst | 15-2051 Business Intelligence Analysts | Boise, ID | 2 | FY2025 to FY2026 | $93,268 | $86,500 to $100,037 | $92,560 | II | H-1B, PERM | December 4, 2025 | G-100-24151-052478 | dol.gov |
| CAD Engineer | 17-2071 Electrical Engineers | Richardson, TX | 2 | FY2026 | $186,721 | $174,765 to $198,677 | $138,278 | IV | H-1B | May 26, 2026 | I-200-26138-922684 | dol.gov |
| CMP Process & Equipment Manager | 17-2112 Industrial Engineers | Manassas, VA | 2 | FY2023 to FY2025 | $187,750 | $172,000 to $203,500 | $138,736 | IV | H-1B | September 30, 2025 | I-200-25266-329309 | dol.gov |
| CPG Supply Engineer | 13-1081 Logisticians | Boise, ID | 2 | FY2024 to FY2026 | $95,007 | $95,007 to $95,007 | $73,320 | III | H-1B, PERM | February 20, 2026 | G-100-24275-376926 | dol.gov |
| Component Engineer 3 | 17-2072 Electronics Engineers, Except Computer | Folsom, CA | 2 | FY2023 to FY2025 | $120,000 | $120,000 to $120,000 | $115,086 | III | H-1B, PERM | July 30, 2025 | G-100-24095-856848 | dol.gov |
| Customer Validation Engineer | 15-1253 Software Quality Assurance Analysts and Testers | Longmont, CO | 2 | FY2026 | $137,500 | $120,000 to $154,000 | $148,470 | IV | H-1B, PERM | June 8, 2026 | I-200-26152-966569 | dol.gov |
| DRAM Design Engineer | 17-2071 Electrical Engineers | Atlanta, GA | 2 | FY2023 to FY2025 | $125,236 | $105,500 to $144,971 | $115,898 | IV | H-1B | December 12, 2024 | I-200-24340-521146 | dol.gov |
| DRAM Design Quality and Reliability Engineer | 17-2071 Electrical Engineers | Boise, ID | 2 | FY2023 to FY2026 | $95,500 | $90,000 to $101,000 | $88,847 | H-1B, PERM | April 13, 2026 | G-100-24355-563439 | dol.gov | |
| DRAM Design Verification Engineer | 17-2071 Electrical Engineers | Atlanta, GA | 2 | FY2024 to FY2026 | $110,586 | $102,820 to $118,353 | $92,955 | II | H-1B, PERM | November 25, 2025 | G-100-24198-199603 | dol.gov |
| DRAM Product Engineer | 17-2071 Electrical Engineers | Boise, ID | 2 | FY2025 to FY2026 | $96,449 | $95,000 to $97,898 | $92,165 | I | H-1B | February 18, 2026 | I-200-26041-631205 | dol.gov |
| DRAM Product Engineer | 17-2072 Electronics Engineers, Except Computer | Boise, ID | 2 | FY2023 to FY2026 | $99,680 | $90,000 to $109,360 | $89,200 | II | H-1B | April 7, 2026 | I-200-26090-743714 | dol.gov |
| DRAM Product Engineer | 17-2112 Validation Engineers | Manassas, VA | 2 | FY2025 to FY2026 | $112,898 | $110,296 to $115,500 | Not listed | PERM | January 14, 2026 | G-100-24242-303046 | dol.gov | |
| DRAM Product Engineer | 17-2071 Electrical Engineers | 2 | FY2024 | $94,418 | $94,418 to $114,418 | $78,666 | Level I | PERM | March 4, 2024 | A-23012-86766 | dol.gov | |
| DRAM Product Quality Assurance Engineer | 17-2112 Manufacturing Engineers | Manassas, VA | 2 | FY2023 to FY2026 | $105,088 | $92,037 to $118,138 | $97,292 | II | H-1B | March 24, 2026 | I-200-26076-709655 | dol.gov |
| DRAM Thin Films Process Development Engineer-Technology Deve | 17-2131 Materials Engineers | Boise, ID | 2 | FY2023 to FY2026 | $112,000 | $112,000 to $112,000 | $88,525 | III | H-1B, PERM | November 19, 2025 | G-100-24190-179236 | dol.gov |
| Data Engineer | 15-2051 Data Scientists | Boise, ID | 2 | FY2023 to FY2025 | $112,100 | $101,000 to $123,200 | $87,672 | II | H-1B | November 12, 2024 | I-200-24309-451868 | dol.gov |
| Data Science Engineer | 15-2051 Data Scientists | Manassas, VA | 2 | FY2024 to FY2025 | $111,395 | $110,739 to $112,051 | $106,506 | II | H-1B | June 18, 2025 | I-200-25162-081980 | dol.gov |
| Data Scientist | 15-2051 Data Scientists | San Jose, CA | 2 | FY2024 | $150,257 | $148,699 to $151,815 | $128,190 | II | H-1B | September 6, 2024 | I-200-24242-304236 | dol.gov |
| Data Scientist | 15-2051 Data Scientists | Manassas, VA | 2 | FY2023 to FY2024 | $131,400 | $122,400 to $140,400 | $102,274 | II | H-1B | June 17, 2024 | I-200-24162-089563 | dol.gov |
| Data Scientist | 15-2041 Statisticians | 2 | FY2023 | $113,282 | $102,900 to $143,665 | $55,058 | Level I | PERM | April 10, 2023 | A-22075-26564 | dol.gov | |
| Design Engineer | 17-2071 Electrical Engineers | Boise, ID | 2 | FY2023 to FY2026 | $132,918 | $115,835 to $150,000 | $124,727 | II | H-1B | March 3, 2026 | I-200-26055-660606 | dol.gov |
| Design Engineer | 17-2072 Electronics Engineers, Except Computer | 2 | FY2023 to FY2024 | $130,886 | $127,681 to $154,090 | $124,176 | Level II | PERM | February 15, 2024 | A-22278-34032 | dol.gov | |
| Design Engineer | 17-2071 Electrical Engineers | Allen, TX | 2 | FY2023 to FY2024 | $130,021 | $110,042 to $150,000 | $96,450 | II | H-1B | November 17, 2023 | I-200-23313-490702 | dol.gov |
| EMI Characterization Engineer | 17-2071 Electrical Engineers | Boise, ID | 2 | FY2023 to FY2026 | $123,840 | $110,849 to $136,831 | $116,002 | III | H-1B | February 20, 2026 | I-200-26043-637701 | dol.gov |
| Eng-Deg Corecomp-Pe-Yield/Quality | 17-2071 Electrical Engineers | Boise, ID | 2 | FY2024 | $96,379 | $96,379 to $96,379 | $95,555 | II | H-1B | April 29, 2024 | I-200-24113-911601 | dol.gov |
| Engineer - Amd Ret Design | 17-2141 Mechanical Engineers | Boise, ID | 2 | FY2025 | $97,696 | $83,000 to $112,392 | $88,275 | III | H-1B, PERM | July 30, 2025 | G-100-24099-865608 | dol.gov |
| Engineer - Cvd/Diff Dram | 17-2131 Materials Engineers | Boise, ID | 2 | FY2026 | $119,995 | $119,995 to $119,995 | $100,287 | IV | H-1B | May 22, 2026 | I-200-26135-917441 | dol.gov |
| Engineer - Deg Pe | 17-2071 Electrical Engineers | Boise, ID | 2 | FY2025 to FY2026 | $92,595 | $89,635 to $95,555 | Not listed | PERM | April 13, 2026 | G-100-24345-532395 | dol.gov | |
| Engineer “ Metrology “ Dram/Em | 17-2131 Materials Engineers | Boise, ID | 2 | FY2025 | $137,725 | $137,725 to $137,725 | $100,172 | IV | H-1B | May 16, 2025 | I-200-25129-960976 | dol.gov |
| Engineer, Demqra Compute Rtd | 17-2072 Electronics Engineers, Except Computer | Boise, ID | 2 | FY2026 | $104,312 | $104,312 to $104,312 | $92,924 | III | H-1B | May 7, 2026 | I-200-26120-856158 | dol.gov |
| Engineer, Dram Device & Cell Technology | 17-2071 Electrical Engineers | Boise, ID | 2 | FY2024 to FY2025 | $118,324 | $117,300 to $119,347 | $99,414 | II | H-1B | May 5, 2025 | I-200-25118-911532 | dol.gov |
| Engineer-Td Rel | 17-2071 Electrical Engineers | Boise, ID | 2 | FY2023 to FY2026 | $126,694 | $113,828 to $139,561 | $106,412 | II | H-1B | April 20, 2026 | I-200-26103-787044 | dol.gov |
| EPS Process Manager | 17-2112 Industrial Engineers | San Jose, CA | 2 | FY2023 | $113,670 | $105,518 to $121,821 | $104,000 | II | H-1B | February 13, 2023 | I-200-23037-753465 | dol.gov |
| Engineer - Design Verification | 17-2071 Electrical Engineers | Allen, TX | 2 | FY2024 to FY2026 | $106,575 | $105,000 to $108,150 | $84,198 | II | H-1B, PERM | February 5, 2026 | G-100-24271-371106 | dol.gov |
| Engineer - Dry Etch NVM | 17-2041 Chemical Engineers | Boise, ID | 2 | FY2025 to FY2026 | $103,196 | $97,584 to $108,808 | $101,130 | II | H-1B, PERM | March 12, 2026 | G-100-24319-474470 | dol.gov |
| Engineer - Metals DRAM | 17-2131 Materials Engineers | Boise, ID | 2 | FY2026 | $119,995 | $119,995 to $119,995 | $110,146 | IV | H-1B | May 20, 2026 | I-200-26133-905930 | dol.gov |
| Engineer - YE DRAM DA | 17-2071 Electrical Engineers | Boise, ID | 2 | FY2025 to FY2026 | $98,941 | $90,100 to $107,782 | Not listed | PERM | November 25, 2025 | G-100-24199-203337 | dol.gov |
1,508 role and worksite groups in all; the 150 with the most cases are shown.
Worksite states
| State | Cases |
|---|---|
| Idaho | 1,162 |
| California | 295 |
| Virginia | 204 |
| Texas | 119 |
| Colorado | 84 |
| Georgia | 65 |
| Minnesota | 19 |
| Arizona | 2 |
| North Carolina | 2 |
| New York | 2 |
Also on SpecStream
- Every company hiring Electrical Engineers in Idaho
- Every company hiring Industrial Engineers in Idaho
- Every company hiring Materials Engineers in Idaho
Updated June 29, 2026. Read from US Department of Labor, Office of Foreign Labor Certification. Public domain (U.S. government work). A certified labor condition application (H-1B, H-1B1, E-3) or PERM labor certification is an employer filing the Department of Labor approved. It is not a count of people hired or visas issued. Wages are as the employer filed them, converted to a yearly figure at 2,080 hours; a wage whose unit is missing is left blank. The files show the first worksite of a case. Free to reuse with credit to SpecStream under CC BY 4.0. Spot a wrong value? Write to [email protected] with the link to this page.