Data / Hiring / Idaho / Micron Idaho Semiconductor Manufacturing (Triton) LLC
Micron Idaho Semiconductor Manufacturing (Triton) LLC in Boise, ID: 130 certified H-1B cases, FY2023 to FY2026
Micron Idaho Semiconductor Manufacturing (Triton) LLC, Boise, ID, had 130 certified H-1B cases in Department of Labor disclosure data, decided from March 8, 2023 to June 25, 2026: 130 H-1B labor condition applications. Its most frequent role is Semiconductor Process Engineer in Boise, ID, at a median offered wage of $111,118 a year.
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- 92-0404803Employer ID (FEIN)
- Boise, IDAddress
- 130Certified cases
- 130Positions requested
- 1Denied or withdrawn
Certified cases by fiscal year
Fiscal years run from October 1 to September 30. The latest year covers decisions through June 25, 2026.
| Fiscal year | H-1B | PERM | Positions | Median offered wage |
|---|---|---|---|---|
| FY2023 | 2 | 0 | 2 | $126,640 |
| FY2024 | 23 | 0 | 23 | $106,575 |
| FY2025 | 40 | 0 | 40 | $108,750 |
| FY2026 | 65 | 0 | 65 | $115,000 |
Roles certified
Cases with the same job title, occupation code and worksite are grouped. Offered wage is the wage the employer filed; the range leaves out the lowest and highest 5% when a group has 20 cases or more. The prevailing wage is the one the employer filed against. A blank worksite means the file does not give one.
| Job title | Occupation | Worksite | Cases | Years | Median offered | Offered range | Median prevailing | Wage level | Program | Latest decision | Latest case number | Source |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Semiconductor Process Engineer | 17-2131 Materials Engineers | Boise, ID | 13 | FY2024 to FY2026 | $110,000 | $83,000 to $120,000 | $80,579 | II | H-1B | June 25, 2026 | I-200-26169-027473 | dol.gov |
| Semiconductor Process Engineer | 17-2112 Manufacturing Engineers | Boise, ID | 7 | FY2025 to FY2026 | $98,919 | $85,075 to $120,000 | $93,974 | I | H-1B | May 20, 2026 | I-200-26133-906090 | dol.gov |
| Equipment Engineer | 17-2141 Mechanical Engineers | Boise, ID | 5 | FY2025 to FY2026 | $103,000 | $97,757 to $140,000 | $82,493 | II | H-1B | May 21, 2026 | I-200-26134-909762 | dol.gov |
| CMP Senior Process Engineer | 17-2131 Materials Engineers | Boise, ID | 3 | FY2024 to FY2026 | $121,125 | $121,125 to $128,393 | $90,251 | III | H-1B | April 29, 2026 | I-202-26112-822525 | dol.gov |
| Manufacturing Engineer | 17-2112 Manufacturing Engineers | Boise, ID | 3 | FY2024 to FY2025 | $96,000 | $91,029 to $120,000 | $91,029 | II | H-1B | April 30, 2025 | I-200-25113-895246 | dol.gov |
| Operations Improvement Engineer | 17-2112 Industrial Engineers | Boise, ID | 3 | FY2024 to FY2026 | $106,698 | $99,263 to $107,000 | $102,752 | II | H-1B | May 4, 2026 | I-200-26117-839242 | dol.gov |
| ="Senior Manager Central Probe Planning" | Industrial Engineers | Boise, ID | 2 | FY2025 | $148,501 | $148,501 to $148,501 | $110,510 | III | H-1B | February 4, 2025 | I-200-25028-648550 | dol.gov |
| Engineer, Id1 Me - Fs Equipment | 17-2072 Electronics Engineers, Except Computer | Boise, ID | 2 | FY2026 | $102,752 | $102,752 to $102,752 | $87,235 | II | H-1B | May 12, 2026 | I-200-26125-872160 | dol.gov |
| Equipment Engineer | 17-2112 Industrial Engineers | Boise, ID | 2 | FY2025 to FY2026 | $140,000 | $115,000 to $165,000 | $120,578 | II | H-1B | April 1, 2026 | I-200-26084-729778 | dol.gov |
| FE US Expansion Planning Engineer | 17-2112 Industrial Engineers | Boise, ID | 2 | FY2024 | $87,199 | $86,423 to $87,975 | $79,872 | II | H-1B | June 3, 2024 | I-200-24145-034766 | dol.gov |
| Principal Engineer, DRAM YE/YA | 11-9041 Architectural and Engineering Managers | Boise, ID | 2 | FY2025 | $168,500 | $168,500 to $168,500 | $129,293 | II | H-1B | May 15, 2025 | I-200-25128-954884 | dol.gov |
| Semiconductor Facilities Engineer | 17-2112 Industrial Engineers | Boise, ID | 2 | FY2025 to FY2026 | $109,000 | $98,000 to $120,000 | $98,363 | II | H-1B | February 4, 2026 | I-200-26028-597795 | dol.gov |
| Semiconductor Facilities Engineer | 17-2051 Civil Engineers | Boise, ID | 2 | FY2024 to FY2025 | $104,136 | $98,272 to $110,000 | $82,296 | III | H-1B | June 6, 2025 | I-200-25150-036822 | dol.gov |
| Semiconductor Manufacturing Process Engineer | 17-2131 Materials Engineers | Boise, ID | 2 | FY2025 to FY2026 | $94,600 | $92,700 to $96,500 | $75,494 | II | H-1B | January 13, 2026 | I-200-26006-537567 | dol.gov |
| Semiconductor Process Engineer | 17-2041 Chemical Engineers | Boise, ID | 2 | FY2026 | $117,046 | $106,093 to $128,000 | $103,501 | III | H-1B | April 14, 2026 | I-200-26097-767060 | dol.gov |
| Senior Semiconductor Process Engineer | 17-2131 Materials Engineers | Boise, ID | 2 | FY2025 to FY2026 | $147,204 | $144,999 to $149,408 | $105,123 | IV | H-1B | June 10, 2026 | I-200-26154-977079 | dol.gov |
| Senior Semiconductor Process Engineer | 17-2071 Electrical Engineers | Boise, ID | 2 | FY2024 to FY2025 | $115,500 | $96,000 to $135,000 | $101,608 | I | H-1B | May 6, 2025 | I-200-25119-915463 | dol.gov |
| 1D1 Senior Program Manager | 17-2071 Electrical Engineers | Boise, ID | 1 | FY2024 | $135,000 | $135,000 to $135,000 | $115,544 | III | H-1B | May 7, 2024 | I-200-24121-942775 | dol.gov |
| ="Engineer-Difi Process" | Materials Engineers | Boise, ID | 1 | FY2025 | $104,974 | $104,974 to $104,974 | $70,408 | II | H-1B | February 27, 2025 | I-200-25051-710398 | dol.gov |
| ="Ram Engineer - Id1" | Chemical Engineers | Boise, ID | 1 | FY2025 | $101,000 | $101,000 to $101,000 | $79,581 | I | H-1B | February 18, 2025 | I-200-25041-680450 | dol.gov |
| ="Real-Time Defect Analysis Engineer" | Electronics Engineers, Except Computer | Boise, ID | 1 | FY2025 | $125,000 | $125,000 to $125,000 | $96,470 | III | H-1B | January 3, 2025 | I-200-24361-572184 | dol.gov |
| ="Yield Analysis Manager" | Architectural and Engineering Managers | Boise, ID | 1 | FY2025 | $160,430 | $160,430 to $160,430 | $129,293 | II | H-1B | March 27, 2025 | I-200-25079-791348 | dol.gov |
| ATE Process Engineer | 17-2112 Industrial Engineers | Boise, ID | 1 | FY2025 | $96,000 | $96,000 to $96,000 | $93,974 | II | H-1B | May 1, 2025 | I-200-25114-900238 | dol.gov |
| ATE Process Engineer | 17-2131 Materials Engineers | Boise, ID | 1 | FY2025 | $96,000 | $96,000 to $96,000 | $50,565 | I | H-1B | May 1, 2025 | I-200-25114-900219 | dol.gov |
| CMP Process Engineer | 17-2141 Mechanical Engineers | Boise, ID | 1 | FY2024 | $93,000 | $93,000 to $93,000 | $66,997 | II | H-1B | April 25, 2024 | I-200-24109-903189 | dol.gov |
| CMP Staff Process Engineer | 17-2131 Materials Engineers | Boise, ID | 1 | FY2026 | $128,393 | $128,393 to $128,393 | $119,995 | IV | H-1B | April 28, 2026 | I-200-26111-816256 | dol.gov |
| DRAM Failure Analysis Engineer | 17-2072 Electronics Engineers, Except Computer | Boise, ID | 1 | FY2026 | $112,793 | $112,793 to $112,793 | $92,934 | II | H-1B | May 6, 2026 | I-200-26119-847920 | dol.gov |
| Director, ATE Photolithography “ ID1 | 11-9041 Architectural and Engineering Managers | Boise, ID | 1 | FY2025 | $218,800 | $218,800 to $218,800 | $190,798 | IV | H-1B | May 14, 2025 | I-200-25127-951042 | dol.gov |
| ENGINEER - OI (Software Development Engineer 2) | 13-1081 Logistics Engineers | Boise, ID | 1 | FY2024 | $95,000 | $95,000 to $95,000 | $52,728 | II | H-1B | April 19, 2024 | I-200-24103-883179 | dol.gov |
| Engineer, Process Integration | 17-2072 Electronics Engineers, Except Computer | Boise, ID | 1 | FY2026 | $97,531 | $97,531 to $97,531 | $81,536 | I | H-1B | May 14, 2026 | I-200-26127-882230 | dol.gov |
| Engineer, RAM Hardware ID1 | 17-2112 Manufacturing Engineers | Boise, ID | 1 | FY2025 | $98,000 | $98,000 to $98,000 | $84,926 | I | H-1B | September 30, 2025 | I-200-25266-327183 | dol.gov |
| Expansion Planning Engineer | 17-2112 Industrial Engineers | Boise, ID | 1 | FY2025 | $100,500 | $100,500 to $100,500 | $93,974 | II | H-1B | May 16, 2025 | I-200-25129-960230 | dol.gov |
| FE US Expansion Planning Strategy Engineer | 17-2112 Manufacturing Engineers | Boise, ID | 1 | FY2024 | $95,000 | $95,000 to $95,000 | $79,872 | II | H-1B | May 10, 2024 | I-200-24124-956596 | dol.gov |
| Facilities Capacity Planning Engineer | 17-2112 Industrial Engineers | Boise, ID | 1 | FY2026 | $100,707 | $100,707 to $100,707 | $84,926 | I | H-1B | March 17, 2026 | I-200-26069-692467 | dol.gov |
| Facilities Capital Planner Engineer 2 | 17-2112 Industrial Engineers | Boise, ID | 1 | FY2024 | $86,500 | $86,500 to $86,500 | $79,872 | II | H-1B | April 11, 2024 | I-200-24095-857469 | dol.gov |
| Facilties Operations Controls Engineer | 17-2112 Industrial Engineers | Boise, ID | 1 | FY2025 | $120,000 | $120,000 to $120,000 | $93,974 | II | H-1B | June 27, 2025 | I-200-25171-116467 | dol.gov |
| HVM Project Engineer | 17-2112 Industrial Engineers | Boise, ID | 1 | FY2026 | $113,997 | $113,997 to $113,997 | $113,997 | H-1B | May 21, 2026 | I-200-26134-911260 | dol.gov | |
| Id1 Senior Program Manager | 17-2131 Materials Engineers | Boise, ID | 1 | FY2024 | $135,000 | $135,000 to $135,000 | $86,445 | II | H-1B | May 3, 2024 | I-200-24117-930196 | dol.gov |
| ID1 Sr Program Manager | 17-2071 Electrical Engineers | Austin, TX | 1 | FY2023 | $126,640 | $126,640 to $126,640 | $121,638 | III | H-1B | June 16, 2023 | I-200-23160-096979 | dol.gov |
| ID1 Sr Program Manager | 11-9041 Architectural and Engineering Managers | Boise, ID | 1 | FY2023 | $126,640 | $126,640 to $126,640 | $118,997 | II | H-1B | March 8, 2023 | I-200-23060-813752 | dol.gov |
| ID1 Yield Analysis Engineer | 17-2041 Chemical Engineers | Boise, ID | 1 | FY2026 | $99,486 | $99,486 to $99,486 | $97,822 | II | H-1B | May 6, 2026 | I-200-26119-847910 | dol.gov |
| Lead Principal Engineer, Id1 Ate Cmp Process | 11-9041 Architectural and Engineering Managers | Boise, ID | 1 | FY2026 | $164,052 | $164,052 to $164,052 | $143,478 | II | H-1B | April 1, 2026 | I-200-26084-729884 | dol.gov |
| Lead Principal Engineer, Process Quality | 17-2141 Mechanical Engineers | Boise, ID | 1 | FY2025 | $170,000 | $170,000 to $170,000 | $88,275 | III | H-1B | June 30, 2025 | I-200-25174-121174 | dol.gov |
| Manager, FE US Expansion Planning Probe | 11-9041 Architectural and Engineering Managers | Boise, ID | 1 | FY2024 | $124,432 | $124,432 to $124,432 | $106,912 | II | H-1B | February 8, 2024 | I-200-24032-684449 | dol.gov |
| Manager, Quality & Deviation Management | 11-9041 Architectural and Engineering Managers | Boise, ID | 1 | FY2026 | $148,500 | $148,500 to $148,500 | $143,478 | II | H-1B | May 12, 2026 | I-200-26125-869107 | dol.gov |
| Metrology Applications Engineer | 17-2131 Materials Engineers | Boise, ID | 1 | FY2025 | $147,000 | $147,000 to $147,000 | $90,251 | III | H-1B | April 8, 2025 | I-200-25091-818617 | dol.gov |
| Oi Scheduling Manager | 11-1021 General and Operations Managers | Boise, ID | 1 | FY2026 | $180,747 | $180,747 to $180,747 | $123,843 | IV | H-1B | April 24, 2026 | I-200-26107-807208 | dol.gov |
| Oi Scheduling Manager | 11-9041 Architectural and Engineering Managers | Boise, ID | 1 | FY2026 | $180,747 | $180,747 to $180,747 | $143,478 | II | H-1B | May 11, 2026 | I-200-26124-867286 | dol.gov |
| Operation Improvement Engineer | 17-2112 Industrial Engineers | San Jose, CA | 1 | FY2026 | $120,599 | $120,599 to $120,599 | $120,182 | II | H-1B | January 6, 2026 | I-200-25363-513507 | dol.gov |
| Operation Improvement Engineer | 17-2112 Industrial Engineers | Boise, ID | 1 | FY2025 | $106,529 | $106,529 to $106,529 | $93,974 | II | H-1B | April 11, 2025 | I-200-25094-834325 | dol.gov |
| Operations Improvement Engineer | 13-1111 Management Analysts | Boise, ID | 1 | FY2026 | $105,148 | $105,148 to $105,148 | $71,760 | II | H-1B | April 28, 2026 | I-200-26111-815968 | dol.gov |
| Principal Engineer Oct Adt Pee -Dry Etch | 17-2199 Engineers, All Other | Boise, ID | 1 | FY2026 | $169,906 | $169,906 to $169,906 | $168,064 | IV | H-1B | February 25, 2026 | I-200-26049-648777 | dol.gov |
| Photo Equipment Engineer | 17-2072 Electronics Engineers, Except Computer | Boise, ID | 1 | FY2026 | $104,312 | $104,312 to $104,312 | $92,934 | II | H-1B | May 6, 2026 | I-200-26119-848362 | dol.gov |
| Photolithography Process Engineer | 17-2131 Materials Engineers | Boise, ID | 1 | FY2026 | $95,000 | $95,000 to $95,000 | $80,579 | II | H-1B | February 25, 2026 | I-200-26049-649121 | dol.gov |
| Principal ID1 Program Manager | 17-2071 Electrical Engineers | Austin, TX | 1 | FY2026 | $158,601 | $158,601 to $158,601 | $140,920 | III | H-1B | January 7, 2026 | I-200-25364-517050 | dol.gov |
| Process Control Engineer | 17-2112 Industrial Engineers | Boise, ID | 1 | FY2026 | $98,000 | $98,000 to $98,000 | $84,926 | I | H-1B | May 11, 2026 | I-200-26124-864584 | dol.gov |
| Process Engineer | 17-2131 Materials Engineers | Boise, ID | 1 | FY2026 | $108,124 | $108,124 to $108,124 | $80,579 | II | H-1B | May 18, 2026 | I-200-26131-894850 | dol.gov |
| Process Engineer | 17-2041 Chemical Engineers | Boise, ID | 1 | FY2024 | $110,000 | $110,000 to $110,000 | $96,845 | II | H-1B | April 11, 2024 | I-200-24095-855943 | dol.gov |
| Process Integration Engineer | 17-2041 Chemical Engineers | Boise, ID | 1 | FY2025 | $111,252 | $111,252 to $111,252 | $97,822 | II | H-1B | August 18, 2025 | I-200-25223-234324 | dol.gov |
| Process Integration Engingeer | 17-2112 Manufacturing Engineers | Boise, ID | 1 | FY2025 | $110,984 | $110,984 to $110,984 | $102,752 | II | H-1B | September 19, 2025 | I-200-25255-305786 | dol.gov |
| Process Safety Engineer (Semiconductor Process Engineer 2) | 17-2141 Mechanical Engineers | Boise, ID | 1 | FY2024 | $90,000 | $90,000 to $90,000 | $66,997 | II | H-1B | April 19, 2024 | I-200-24103-883217 | dol.gov |
| Reticle Coordinator Engineer | 17-2112 Manufacturing Engineers | Boise, ID | 1 | FY2025 | $139,940 | $139,940 to $139,940 | $138,403 | IV | H-1B | September 30, 2025 | I-200-25266-329273 | dol.gov |
| Senior Manager, Id1 Manufacturing Engineering | 11-9041 Architectural and Engineering Managers | Boise, ID | 1 | FY2026 | $160,666 | $160,666 to $160,666 | $143,478 | II | H-1B | May 11, 2026 | I-200-26124-864567 | dol.gov |
| Sr Engineer, Id1 Ate De Process | 17-2041 Chemical Engineers | Boise, ID | 1 | FY2026 | $110,000 | $110,000 to $110,000 | $109,158 | IV | H-1B | April 8, 2026 | I-200-26091-749293 | dol.gov |
| Sr Engineer, US Expansion Planning | 17-2112 Industrial Engineers | Boise, ID | 1 | FY2026 | $113,500 | $113,500 to $113,500 | $102,752 | II | H-1B | June 18, 2026 | I-200-26162-007591 | dol.gov |
| SR. Engineer, Change Management | 17-2141 Mechanical Engineers | Boise, ID | 1 | FY2026 | $112,950 | $112,950 to $112,950 | $97,531 | III | H-1B | December 19, 2025 | I-200-25346-478603 | dol.gov |
| Staff Engineer, Id1 Pee - Ph Equipment | 17-2141 Mechanical Engineers | Boise, ID | 1 | FY2026 | $127,080 | $127,080 to $127,080 | $97,531 | III | H-1B | March 18, 2026 | I-200-26070-696972 | dol.gov |
| Staff Engineer, Id1 Pee Ph Process | 17-2041 Chemical Engineers | Boise, ID | 1 | FY2026 | $140,000 | $140,000 to $140,000 | $103,501 | III | H-1B | December 29, 2025 | I-200-25353-498816 | dol.gov |
| Semiconductor Facilities Engineer | 17-2041 Chemical Engineers | Boise, ID | 1 | FY2024 | $110,000 | $110,000 to $110,000 | $96,845 | II | H-1B | May 2, 2024 | I-200-24116-924496 | dol.gov |
| Semiconductor Process Engineer | 17-2141 Mechanical Engineers | Boise, ID | 1 | FY2024 | $90,000 | $90,000 to $90,000 | $66,997 | II | H-1B | June 3, 2024 | I-200-24145-034590 | dol.gov |
| Senior Engineer - Manufacturing Engineering Planning | 17-2112 Manufacturing Engineers | Boise, ID | 1 | FY2026 | $115,000 | $115,000 to $115,000 | $102,752 | II | H-1B | June 24, 2026 | I-200-26167-020950 | dol.gov |
| Senior Engineer, ID1 PEE PCVD Process | 17-2071 Electrical Engineers | Boise, ID | 1 | FY2026 | $120,000 | $120,000 to $120,000 | $115,835 | II | H-1B | March 26, 2026 | I-200-26078-716967 | dol.gov |
| Senior Engineer, Process Integration | 17-2112 Industrial Engineers | Boise, ID | 1 | FY2026 | $123,500 | $123,500 to $123,500 | $120,578 | III | H-1B | May 4, 2026 | I-200-26117-839639 | dol.gov |
| Senior Equipment Engineer | 17-2112 Industrial Engineers | Boise, ID | 1 | FY2026 | $122,000 | $122,000 to $122,000 | $102,752 | II | H-1B | May 27, 2026 | I-200-26139-926314 | dol.gov |
| Senior Process Safety Engineer | 17-2041 Chemical Engineers | Boise, ID | 1 | FY2024 | $101,000 | $101,000 to $101,000 | $96,845 | II | H-1B | April 19, 2024 | I-200-24103-883148 | dol.gov |
| Senior Wet Etch Equipment Engineer | 17-2112 Industrial Engineers | Boise, ID | 1 | FY2026 | $109,000 | $109,000 to $109,000 | $84,926 | I | H-1B | May 6, 2026 | I-200-26119-850822 | dol.gov |
| Software Development Engineer | 15-1252 Software Developers | Boise, ID | 1 | FY2026 | $97,850 | $97,850 to $97,850 | $72,010 | I | H-1B | May 21, 2026 | I-200-26134-910641 | dol.gov |
| Sr Engineer, F4 IE Layout | 17-2112 Industrial Engineers | Boise, ID | 1 | FY2026 | $115,000 | $115,000 to $115,000 | $102,752 | II | H-1B | November 25, 2025 | I-200-25322-416422 | dol.gov |
| Sr Engineer, ID1 Yield Analysis | 17-2112 Industrial Engineers | Boise, ID | 1 | FY2026 | $128,000 | $128,000 to $128,000 | $102,752 | II | H-1B | February 18, 2026 | I-200-26041-630675 | dol.gov |
| Sr Engineer, Process Integration | 17-2071 Electrical Engineers | Boise, ID | 1 | FY2026 | $130,000 | $130,000 to $130,000 | $115,835 | II | H-1B | March 17, 2026 | I-200-26069-693626 | dol.gov |
| Sr Engineer, Process Integration | 17-2041 Chemical Engineers | Boise, ID | 1 | FY2026 | $120,000 | $120,000 to $120,000 | $103,501 | III | H-1B | May 13, 2026 | I-200-26126-877903 | dol.gov |
| Sr. Engineer, ID1 PEE PCVD Equipment | 17-2141 Mechanical Engineers | Boise, ID | 1 | FY2026 | $130,000 | $130,000 to $130,000 | $112,570 | IV | H-1B | February 24, 2026 | I-202-26048-646237 | dol.gov |
| Sr. Engineer, ID1 RAM RDA APPLICATIONS | 17-2112 Industrial Engineers | Boise, ID | 1 | FY2026 | $111,782 | $111,782 to $111,782 | $102,752 | II | H-1B | April 28, 2026 | I-200-26111-815224 | dol.gov |
| Sr. Engineer, ID1 RAM RDA Applications | 15-1252 Software Developers | Boise, ID | 1 | FY2026 | $120,000 | $120,000 to $120,000 | $100,027 | II | H-1B | May 4, 2026 | I-200-26117-838547 | dol.gov |
| Sr. Semiconductor Process Engineer | 17-2131 Materials Engineers | Boise, ID | 1 | FY2026 | $115,000 | $115,000 to $115,000 | $80,579 | II | H-1B | February 5, 2026 | I-200-26029-601105 | dol.gov |
| Staff Engineer, US Expansion Strategic Planning | 17-2112 Industrial Engineers | Boise, ID | 1 | FY2026 | $136,460 | $136,460 to $136,460 | $120,578 | III | H-1B | April 28, 2026 | I-200-26111-818619 | dol.gov |
| Surface Scientist (Semiconductor Process Engineer 3) | 17-2041 Chemical Engineers | Boise, ID | 1 | FY2024 | $120,000 | $120,000 to $120,000 | $96,845 | II | H-1B | March 12, 2024 | I-200-24065-773361 | dol.gov |
| US Expansion Planning Engineer | 15-2051 Data Scientists | Boise, ID | 1 | FY2025 | $92,866 | $92,866 to $92,866 | $92,560 | II | H-1B | June 3, 2025 | I-200-25147-021939 | dol.gov |
| Wet Etch Staff Process Engineer | 17-2072 Electronics Engineers, Except Computer | Boise, ID | 1 | FY2026 | $154,080 | $154,080 to $154,080 | $92,934 | II | H-1B | February 27, 2026 | I-200-26051-655248 | dol.gov |
| Wet Process Equipment Engineer | 17-2141 Mechanical Engineers | Boise, ID | 1 | FY2025 | $92,700 | $92,700 to $92,700 | $75,462 | II | H-1B | June 17, 2025 | I-200-25161-076142 | dol.gov |
| WorkForce Development Specialist | 17-2131 Materials Engineers | Boise, ID | 1 | FY2024 | $106,575 | $106,575 to $106,575 | $70,408 | II | H-1B | September 10, 2024 | I-200-24247-311165 | dol.gov |
Worksite states
| State | Cases |
|---|---|
| Idaho | 127 |
| Texas | 2 |
| California | 1 |
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Updated June 25, 2026. Read from US Department of Labor, Office of Foreign Labor Certification. Public domain (U.S. government work). A certified labor condition application (H-1B, H-1B1, E-3) or PERM labor certification is an employer filing the Department of Labor approved. It is not a count of people hired or visas issued. Wages are as the employer filed them, converted to a yearly figure at 2,080 hours; a wage whose unit is missing is left blank. The files show the first worksite of a case. Free to reuse with credit to SpecStream under CC BY 4.0. Spot a wrong value? Write to [email protected] with the link to this page.